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7120 / 7130 Models

7120 / 7130 Models

7122

2", DC-brushless, 1.2 kW, front-mounted, air-bearing spindle (60 krpm Max.), with closed-loop turntable. Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm, such as: - Opto-electronic Components - PCB BGA Panels - High-brightness LED Packages - Silicon Wafers - SAW Filters - Glass/Silicon Sensors - MEMS - PZT Read More»

7132

Front mount 2" air bearing spindle, up to 1.2KW at 60krpm. DC Brushless motor provides close-loop speed control. Compatible with 2"-3" hub and hubless blades. Coveriing up to 12" round products, 12" x 9" square substrates with frame or 12" x 12" chuck without frame. The system is equiped with close-loop turn table, optimized for large panels and multi panels such as: * 12" and 8" Silicon wafers * PCB, QFN and BGA Panels * High-brightn Read More»

7124

4", DC-brushless, 2.5 kW, air-bearing spindle, (30 krpm Max.), with closed-loop turntable. Optimized for high-precision, multi-panel dicing of thick and hard material applications up to 200 mm x 200 mm, such as: - Glass - DWDM Optical Filters - Thick Ceramic Substrates Read More»

7134

4" high power air bearing spindle, up to 2.5KW at 30krpm. DC Brushless motor provides close-loop speed control. Coveriing up to 12" round products, 12" x 9" square substrates with frame or 12" x 12" chuck without frame. The system is equiped with close-loop turn table, optimized for multi-angle dicing suitable for variety of products such as: *Ceramic substrates *Alumina *Hybrids *Thick film devices and more Read More»

Extra Large Area Dicing (7100 XLA)

7100 XLA is available with 2" spindle or 4" spindle. The system capable to handle up to 18" x 24" size singulating large PCB substrates or hard and brittle glass and ceramic panels. Read More»

Large Area

Available with both 7132 (2” spindle) and 7134 (4” spindle) systems. The Large Area capability allows not only processing of 12” wafers, but also singulation of large PCB substrates or hard and brittle glass and ceramic substrates. Read More»

Tilting Spindle

The Tilting Spindle capability for the 71TS Model is designed to meet the needs of optoelectronic component manufacturers by providing both perpendicular cuts and 8° angular cuts needed to suppress back-reflection in fiber optic components. A fast, efficient alternative to slow and expensive grinding processes, the Tilting Spindle offers significant cost-saving potential. Read More»

Medical Machine

The 71MD dicing saw system is designed for a demanding and tight application such as PZT. The system is equipped with Height on parts measuring system and it can be provided with large Z clearance in order to support thick jig's. Z linear encoder is equipped with the 71MD machine for best cut depth accuracy. It can be supplied with spindle balancing system for minimizing the spindle vibration. Typical applications for Ultra-Sound sensors. Read More»

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