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Package Singulation

BGA

Description:

Ball Grid Array (BGA) packages are based upon wire-bonded or flip-chipped dies mounted on an FR4/5 or BT resin based laminate.  The back side of the die is usually encapsulated in an epoxy resin.  The package has no leads and connects to the PCB by an array of solder balls.  Typical thicknesses are 0.9 - 2.0 mm (including solder balls).  Most common package sizes are 4x4 to 20x20 mm.

Major Considerations:

Cut quality:

  • Chipping
  • Burrs
  • Slivers
  • Protrusions
  • Trace shorts

End of Blade life:

  • Package size dimension
  • Exposure lost

Saw:

7200 MegaDice, Fully automatic dicing system with built-in cleaning and UV curing, extended Y-travel for dual panel large size QFN's and 2.4KW High torque spindle.

Blade:

  • 2" & 3" Sintered:
    • "4" and "B" matrixes blades for jig-mounted substrates
    • "2" matrixes blades for tape-mounted applications
  • Diamond grit size: 30 - 55 microns
  • Thickness: .008” - .014”

Process Parameters:

  • Feed rate: 50-250 mm/sec
  • Spindle speed: 20-40 krpm depending on blade O.D.
  • Multi panel mounting on UV tape  
  • Minimal dressing in order to avoid large radius on the blade edge
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