Ball Grid Array (BGA) packages are based upon wire-bonded or flip-chipped dies mounted on an FR4/5 or BT resin based laminate. The back side of the die is usually encapsulated in an epoxy resin. The package has no leads and connects to the PCB by an array of solder balls. Typical thicknesses are 0.9 - 2.0 mm (including solder balls). Most common package sizes are 4x4 to 20x20 mm.
End of Blade life:
7200 MegaDice, Fully automatic dicing system with built-in cleaning and UV curing, extended Y-travel for dual panel large size QFN's and 2.4KW High torque spindle.