Tech Library

Micro-Electro-Mechanical Systems (MEMS) include a large variety of miniaturized intelligent mechanical systems such as accelerometers, flow sensors, motion mirrors and radio-frequency devices. MEMS are manufactured by the combination of well-established methods for the fabrication of integrated circuits (ICs) together with various micromachining processes to selectively etch away desired portions of the silicon wafer upon which the device is based or to create additional layers of material,

Ongoing developments in semiconductors have resulted in the improved performance of ICs. Some mostly front-end developments, however, have raised new issues in backend processes, such as wafer dicing. This article concentrates on two laser-based technologies that were developed to meet the new challenges that accompany wafer singulation. According to the widely accepted Moore's Law, IC performance will double about every 18 to 24 months. The uninterrupted continuation of this trend is due to

The well- known law named after Gordon Moore predicts the doubling of integrated circuit (IC) performance every 18 to 24 months. The semiconductor industry owes part of the uninterrupted continuation of this trend to two significant changes it has recently adopted. The first is the transition of metal interconnects from aluminum to copper, due to the higher electrical conductance of the latter. The second is the conversion from the use of traditional silicon dioxide dielectrics to a new class of

The growing variety and complexity of matrix array packages present a true challenge to many back end processes. The singulation of these arrays into individual packages is an important step in the manufacturing process, and as in many cases, needs to be optimized to minimize the overall cost of package. The continuous reduction in package size, along with the uncompromising demand for increased throughput without sacrificing cut quality, has resulted in a shift from shearing/punching techniques

challenge to many back end processes. The singulation of these arrays into individual packages is an important step in the manufacturing process, and as in many cases, needs to be optimized to minimize the overall cost of package. The continuous reduction in package size, along with the uncompromising demand for increased throughput without sacrificing cut quality, has resulted in a shift from shearing/punching techniques