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With four different models to choose from, each optimized for a specific range of applications, the 7100 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.
With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems.
New!!! ADT newly Automatic Dicing Saw 7900 Duo is the ultimate dicing for LED & Discrete devices. With lower Cost of Ownership and ability to double your Dicing floor productivity.
The NextStep System of the laser 8000 Series removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then be diced using a standard mechanical dicing process.
A wide selection of dicing tools to support your process requirements:
Annular Dicing Blades (Resin-bond Blades, Metal-Sintered Blades and Nickel-bond Blades), Dicing Flanges and Dicing Accessories.
We offer a broad range of peripheral equipment to complement our Dicing Saws as part of our “complete dicing solution” concept.
ADT has extensive R&D capabilities comprised of highly skilled personnel and well-equipped process development centers where our engineers identify the platform, dicing blades and dicing methodologies which are most appropriate to solve specific challenges as well as generic industry problems.
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Site Map | Privacy Statement | Terms of Use | Created by Catom.