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LED packaging

LED packaging

Description:

LED packaging usually consists of a base substarate upon which the LEDs are mounted.
Common base substrates in the market are: Cermaic, PCB and QFN

Major Considerations:

  • Chipping
  • Cracks
  • Copper or Silicon burrs
  • Smearing
  • Delamination

Saw:

7132 or 7900LA , Automation and quality control, automatic vision capabilities for multi panel using large area cutting chuck

Blade and Process Parameters:

ADT developed a dicing solution tailored to the specific package type: Ceramic, PCB and QFN 

 

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