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LED PACKAGING

LED packaging usually consists of a base substarate upon which the LEDs are mounted.

Common base substrates in the market are: Cermaic, PCB and EMC/MLF.

 

Major Considerations:

  • Chipping
  • Cracks
  • Copper burrs
  • Die size stability
  • Low blade wear

 

Saw:

7132 or 7900LA , Automation and quality control, automatic vision capabilities for multi panel using large area cutting chuck

 

Blade and Process Parameters:

ADT developed a dicing solution tailored to the specific package type: 

Ceramic, PCB and EMC/MLF