Manual Wafer Mounter 966
Mounting solutions to match your specific needs
ADT Wafer Mounting Systems enable mounting of wafers/substrates to frames using various kinds of tapes.
The systems are offered in two basic configurations:
- WM-966 – up to 8" wafer
- WM-966LA – up to 12" wafer.
- Uniform mounting without air bubbles
- Build-in reeling and removal of UV tape backing
- Mounting plate temperature control
- Compatibility with all film frames; linear and circular tape cutting
- Custom-made chucks for special requirements:
- Thin wafers
- Sensitive surface
- Multiple panels
- ESD protection
- Tape saving mechanism
|Model 966 – 8"||Model 966 – 12"|
|Max. wafer size||Ø 200 mm*||Ø 300 mm*|
|Max. tape width||300 mm||400 mm|
|Plate heating||Up to 80°C||Up to 80°C|
|Machine dimensions (WxDxH)||304 x 800 x 394 mm||330 x 1000 x 560 mm|
|Approx. machine weight||30 kg||60 kg|
** Refers to standard models.