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Manual Wafer Mounter 966

Manual Wafer Mounter 966

Mounting solutions to match your specific needs

ADT Wafer Mounting Systems enable mounting of wafers/substrates to frames using various kinds of tapes.

The systems are offered in two basic configurations:

  • WM-966 – up to 8" wafer
  • WM-966LA – up to 12" wafer.  

 

System Highlights:

  • Uniform mounting without air bubbles
  • Build-in reeling and removal of UV tape backing

  • Mounting plate temperature control
  • Compatibility with all film frames; linear and circular tape cutting

 

  • Custom-made chucks for special requirements:
    • Thin wafers
    • Sensitive surface
    • Multiple panels

 

  • Options:
    • ESD protection
    • Tape saving mechanism

 

Technical Specifications: 

  Model 966 – 8" Model 966 – 12"
Max.  wafer size Ø 200 mm* Ø 300 mm*
Max. tape width 300 mm 400 mm
Plate heating Up to 80°C Up to 80°C
Machine dimensions (WxDxH) 304 x 800 x 394 mm 330 x 1000 x 560 mm
Approx. machine weight 30 kg 60 kg

** Refers to standard models.

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