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Silicon Wafers and Discrete Devices

Silicon Wafers and Discrete Devices

Description:

Silicon is the most common semiconductor material used. It is a gray brittle material with a diamond cubic structure. Silicon wafers are available in sizes up to 12" in diameter, with 6" and 8" being the most common.  Typical thicknesses are in the 100 - 650 micron range.

Major Considerations:

Cut quality:

  • Top-side and back-side chipping
  • Cracking
  • Wafer contamination due to ESD issues and poor cleaning

Saw:

7222, fully automatic dicing saw with WX3 wafer handling system for better throughput and Atomized cleaning or the 7900 Duo automatic Twin spindles for double the throughput  

Blade:

  • 2" hub and Annular Nickel blades
  • Diamond grit size: 2-4 to 4-8 microns
  • Thickness: .0008” - .0014”

Process Parameters:

  • Feed rate: 25 - 75 mm/sec
  • Spindle speed: 30 - 50 krpm
  • Mounting: Blue or UV tape
  • Cooling type: DI water with and without additives
  • Carbon dioxide bubbler is optional

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