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Wafer Cleaner 977

Wafer Cleaner 977

Efficient compact cleaning units to support your process

ADT 977 Wafer Cleaner Systems are designed for cleaning workpieces after dicing.

The systems are offered in three basic configurations :

  • WCS-977 –  round wafer up to 8"
  • WCS-977LA   round wafer up to 12"
  • WCS-977D   a standalone coating/de-coating station with:
    *Wafer spin coating technology
    *Absolute surface protection during dicing
    *100% removal of contamination and residue
    *Atomized cleaning and N2 drying 

977 System Highlights :

  • Atomizing cleaning
  • Automatic lid closing
  • Intuitive control panel
  • Process monitoring
  • Compact design
  • Robust, vibration free
  • Environmentally friendly
  • Options:
    • Build-in mist exhaust unit
    • CO2 injection
    • Customized chucks
    • Cleaning additives

Technical Specifications:

  977- 200 977L - 300
Max. wafer size Ø 200 mm Ø 300 mm
Cleaning method Atomizing cleaning/
High pressure cleaning
Atomizing cleaning/
High pressure cleaning
Number of recipes that can be saved 8 8
Spinner velocity range 200–3000 rpm 200–2500 rpm
Machine dimensions (WxDxH) 410 x 625 x 950 mm 520 x 809 x 950 mm
Approx. machine weight 100 kg 160 kg

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