7900 Duo series – Multiple M/C order

11 July, 2016


Taipei, Taiwan – June 16, 2016 – Advanced Dicing Technologies Ltd., a provider of Revolutionary Total Dicing Solutions for the LED, Semiconductor, IR filters, Glass & Micro electronics packaging manufacturing industry, announces on multiple machine order of 7900 Duo series dicing saw system. Due to an outstanding and innovative approach, superior dicing quality and a much lower Cost-of-Ownership performance, this client decided to grant ADT repeat order of multiple 7900 Duo series machines and set it as a future standard dicing tool for his customer final applications.


The 7900 Duo series dicing saw system provides complete packaging and wafer level dicing capability using a twin spindle technology.  It is the only dicing system in the industry that can satisfy all types of package singulation, IR filters, glass, discrete devices, LED wafers level and silicon-based IC wafers needs. The 7900 Duo series system is capable of dicing material such as: ceramic, glass, aluminum, FR4, molding compounds, solder and other mixed coating layers.  The 7900 Duo series offers an easy to use interface, small footprint and push-to-dice technology while exhibiting an outstanding and reliable performance.  The Auto Shrinkage Correction feature provides the industry the fastest UPH in the market making the 7900 Duo series the “Best in Class” mechanical dicing saw system with very low Cost-of-Ownership.


“Our over-arching goal is to serve our customers even better and offer them the tools they need to achieve higher yields at lower running cost on their most advanced products” says Moshe Plopsky, MD ADT Taiwan.


“We are pleased with 7900 Duo performance & superb service. With re-selection of ADT’s 7900 Duo series, we are able to dice more glass in less time and manpower engagement due to their innovative dicing approach while allowing the lowest Cost-of Ownership in the industry.” added Simon Liu, VP of Operations.


About Advanced Dicing Technologies (ADT) Ltd,

With headquarters in the Yoknam Hi-Tech Park Israel, ADT Ltd. is the most prestige and cost- effective company that specialized in the development and manufacturing of dicing systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, annular blades and process know-how we bring our customers comprehensive dicing solutions.


ADT systems are used both in production & engineering process with aim to increase productivity and final yield. Our philosophy is aligning with customer’s expectation: Smart design, fast ROI, Lower COO and professional service.

ADT is committed to provide the best performance in every project.




Name: Moshe Plopsky, Managing Director ADT TW