Fully Automatic 12" Twin - 8030 Series
ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product, at high performances and low cost of operation.
FEATURE & BENEFITS
• Bridge type frame
• Flexibility - Supports Hub and Hubless blades up to 3” O.D.
• Dual microscopes, fixed non-contact sensors and two dress stations
• Spindles of 1.8 KW or 2.2 KW high power (for challenging applications)
• Superior vision system with continuous zoom magnification
• Intuitive operation interface using a large 19” touch screen monitor
EASE OF USE
The 8030 operates with the ADT intuitive New graphic User Interface (NUI) and includes two touch - screens: 19” monitor for the main screen and 17” monitor maintenance screen.
OTHER KEY FEATURES OF IMPORTANCE
• Highest dicing process speeds - Lowest cost
• Support up to 12” × 12” square products
• Industrial PC based on Win 10 OS
• Air bearing feed axis (X)
• Fast & Simple blade change with a spindle shaft lock mechanism
• Fast automatic alignment and cut positioning for increased throughput
• Automatic Kerf inspection and quality analysis for maximum precision
• Process data logging and statistical analysis
• SECS / GEM platform ready
• Load port ready for factory automation
• All electronic on top of the cut chamber
LEADING APPLICATIONS
• Silicon wafers for Memory and Logic products
• MEMS (micro-electromechanical system)
• CMOS Image Sensors (CIS)
• Packaging (FOPLP, FOWLP, QFN, BGA)
8030 Specifications:
Note: Specifications are subject to change without notice.