7120 / 7130 Models

Large Area

Available with both 7132 (2” spindle) and 7134 (4” spindle) systems.
The Large Area capability allows not only processing of 12” wafers, but also singulation of large PCB substrates or hard and brittle glass and ceramic substrates.  

 

Features & Benefits

  • Allows Dicing of 12” x 12” Substrates (without frame) or 12” Diameter Wafers (with frames)
  • Available on the 2” spindle or 4” spindle
  • Does not increase the footprint of 7120 / 7130 Series base architecture
  • Increased theta precision for high accuracy over long cut lengths
  • Spacious load and unload area for large substrates and 12” wafers
  • Excellent for singulating large PCB or ceramic substrates
  • Stationary, non-contact height compensation for 2” or 4” systems
  • Customized chuck configurations

For more details please contact your ADT local representative.  

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