8030 – Fully Automatic Twin Spindle Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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7224 - Fully automatic dicing saw
FEATURES & BENEFITS
- Efficient wafer handling system
- Continuous digital magnifications vision system
- Blade wear prediction algorithm reduces height measurement time and increases UPH
- Atomized wafer cleaning technology for superior process results
RELATED DOCUMENTS
TECHNICAL SPECIFICATIONS
| Specifications | 7224 | |
| Workpiece Size | Ø 8” | |
| Spindle | 30K rpm / 2.5 kW | |
| Blade Size | 4” – 5” | |
| Y Axis | Control Resolution Cumulative Accuracy Indexing Accuracy | Linear encoder for each Y axis 0.1 µm 1.5 µm 1.0 µm |
| X Axis | Air Slide | |
| Z Axis | Resolution Repeatability | 0.2 µm 1.0 µm |
| Θ Axis | Repeatability Stroke | 4 arc-sec 380° |
| Cleaning Station Full rinse and dry cycle | Spinning speed Cleaning Method | 100-2,000 rpm Atomized cleaning capabilities |
| Utilities | Electrical | 200-240 VAC, 50/60 Hz, single phase |
| Dimensions | (W x D x H) mm Weight | 965 × 1460 × 1700 1,200kg |
MATERIALS
- Glass on Silicon
- MEMS
- Package Singulation (BGA & QFN)
- LTCC
- PCB
- Hard Materials
