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7232 - Fully automatic dicing saw


FEATURES & BENEFITS

  • Efficient wafer handling system
  • Continuous digital magnifications vision system
  • Blade wear prediction algorithm reduces height measurement time and increases UPH
  • Atomized wafer cleaning technology for superior process results

RELATED DOCUMENTS

   Dicing Saws  

   7232

 

TECHNICAL SPECIFICATIONS

Specifications7232
Workpiece SizeØ 12” or 253x243mm
Spindle60K rpm / 1.8 kW or 2.2KW
Blade Size2” – 3”
Y AxisControl
Resolution
Cumulative Accuracy
Indexing Accuracy
Linear encoder
0.1 µm
1.5 µm
1.0 µm
X AxisAir Slide
Z AxisResolution
Repeatability
0.2 µm
1.0 µm
Θ AxisRepeatability
Stroke
4 arc-sec
380°
Cleaning Station
Spinning speed Cleaning
Method
Full rinse and dry cycle
100-2,000 rpm
Atomized cleaning capabilities
UtilitiesElectrical200-240 VAC, 50/60 Hz, single phase
Dimensions(W x D x H) mm
Weight
1100 × 1785 × 1700
1,350kg

MATERIALS

  • Silicon
  • Glass on Silicon
  • MEMS
  • GaAs wafers
  • Package Singulation
  • (BGA & QFN)
  • LTCC
  • PCB
  • Hard Materials