8030 – Fully Automatic Twin Spindle Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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80WT - Fully automatic dicing saw
80WT - TECHNOLOGY
LASER MAPPING PROCESS
Precise mapping of the QFN substrate surface
- High sampling rate
- Sampling speed 50mm/sec
- Repeatability 1μm
- enclosure rating IP76
FIXED DEPTH GROOVE ACCORDING TO MAPPED SURFACE
- Constant depth of cut groove
- By Z and X interpolation
- Final cut depth accuracy ±15µm
FEATURES & BENEFITS
Fully automatic two spindles dicing saw, designed for precise step-cut Wettable QFN dicing. The 80wt performs perfect grooving operation with constant depth of cut and groove shape, on an uneven surface of the substrate.
QFN MAGAZINE
Loading up to 4 QFN magazines, Each with up to 20 QFN substrates
TAPELESS PROCESS
TWIN SYSTEM
Double spindle
CLEANING UNIT WASH & DRY
Optional:
- Brush + High Pressure Jet
- Pressure Jet
- Atomizing Jet
CHUCK TABLE
Automatic loading 2 QFN panels (can support single panel)
BRUSH DEBURRING
PRE ALIGNMENT
For the 2 substrates simultaneously
80WT - OPTIONAL ADD-ONS
- Up to 76.2mm (3”) Blades OD
- SECS GEM ready
- Ionizer Bar – ESD discharge
- Broken Blade Detection (BBD)
- BARCODE item identification
RELATED DOCUMENTS
80WT - PROCESS SEQUENCE
STEP 1 Magazine scanning
STEP 2 Substrate loading and alignment
STEP 3 Laser mapping
STEP 4 Dicing
STEP 5 Brush Deburring
STEP 6 Cleaning
CYCLE TIME INFORMATION
PROCESS
Feed Rate: 50 mm/sec
Mapping Feed Rate: 50 mm/sec
Mapping Rate: 5 Cuts
CYCLE TIME - 2 LEAD-FRAMES
- Laser mapping total time: ~ 2 min
- Dicing total time: about 5.5 min including alignment
- Brush total time: 30 sec
- Total time: about 8 min
BRUSH
Brush Cycles: 1 Feed Rate
During Brush: 10 mm/sec
CLEANING CYCLE TIME
- Rinse : 500 rpm | 30 sec
- Atomizing: 800 rpm | 60 sec
- Air Drying: 1200 rpm | 30 sec
Since cleaning is done during dicing the cleaning time does not effect the total processing time
TECHNICAL SPECIFICATIONS
| Specifications | 80WT | |
| Workpiece Size | up to12" by 12" Square | |
| Spindle | 1.8 KW Two facing spindles | |
| LMS (Laser Mapping System) | Accuracy | ±15 μm |
| Blade Size | 2" - 3" | |
| Y1 / Y2 Axis | Drive Control Resolution Cumulative Accuracy Indexing Accuracy Cutting Range | Ball bearing lead screw Linear encoder for each Y axis 0.1 µm 1.5 µm 1.0 µm 350 mm |
| X Axis Air Slide | Drive Feed rate Cutting range | Ball bearing lead screw Up to 1000 mm/sec 310 mm |
| Z1 / Z2 Axis | Drive Resolution Repeatability Max. stroke | Ball bearing lead screw 0.2 µm 1.0 µm 50 mm (for 2.188” blade OD) |
| Θ Axis | Drive Repeatability Stroke | Closed-loop, Direct-drive 4 arc-sec 380° |
| Vision System | USB3 camera, High bright LED | |
| Cleaning Station Full rinse and dry cycle | Spinning speed Cleaning method | 100-3,000 rpm Atomized cleaning capabilities |
| Wafer Handling system | Slot to slot integrity Tapeless system |
|
| Standard Features | Automatic alignment Automatic Cut verify Automatic Kerf inspection Automatic Y offset correction |
|
| Utilities | Electrical Air Spindle Coolant (per spindle) Cutting water (per spindle) | 200-240 VAC, 50/60 Hz, single phase 500 L/min @ 5.5 bar 1.1 L/min Up to 3 L/min |
| Dimensions | (W x D x H) mm Weight | 1145 × 1687 × 1830 mm 1,500kg |
| Environmental | Room Temperature: 20°C to 25°C ± 1°C (77°F ± 1.8°F) Humidity: Less than 70% relative humidity (non-condensing) Cutting water / Spindle Water Temperature ± 1°C (± 1.8°F) Floor must be vibration free |
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80WT - OPTIONAL ADD-ONS
- Up to 76.2mm (3”) Blades OD
- SECS GEM ready
- Ionizer Bar – ESD discharge
- Inline Deburring Brush
- BARCODE item identification
- HMT – Height measurement tool
- LMS – Laser mapping system
