2" Spindle - ADT - Advanced Dicing Technologies https://www.adt-co.com/dicing_saw_cat/2-spindle-fully-automatic-single-spindle/ Advanced Dicing Technologies, Dicing Saws, Blades Sun, 11 Jan 2026 06:33:41 +0000 en-US hourly 1 https://wordpress.org/?v=7.0 https://www.adt-co.com/wp-content/uploads/2023/07/cropped-android-chrome-96x96-1-32x32.png 2" Spindle - ADT - Advanced Dicing Technologies https://www.adt-co.com/dicing_saw_cat/2-spindle-fully-automatic-single-spindle/ 32 32 7302 – Fully automatic dicing saw https://www.adt-co.com/dicing_saw/fully-automatic-dicing-saws/7302-dicing-saw/ Sun, 21 May 2023 13:29:17 +0000 https://rwolf.co.il/dicing_saw/automatic-dicing-saws/7122-2-3-5/ Up to 12” round product,
or 9” x 12”square chuck
Up to 12” Silicon Wafers
PCB, QFN and BGA multi panels, LED Packages

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FEATURES & BENEFITS

  • Support 2″-3″ blade O.D.
  • Internal air flow management minimizing product contamination
  • Multi panel dicing
  • ‘X’ axis air bearing for smooth motion and super cut quality
  • Automation with high resolution optics
  • Custom process solution

RELATED DOCUMENTS

   Dicing Saws Catalog

   7302

   73XX Leaflet

Additional FEATURES & BENEFITS

  • UV LED curing system
  • Broken Blade detector (for 2” spindle)
  • Exhaust impeller
  • High power 2” spindle up to 2.2KW
  • Height Measuring Tool (HMT)
  • ESD kit
  • UPS
  • Bar code reader (Internal or external)
  • SECS GEM communication protocol

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]]> 7222 https://www.adt-co.com/dicing_saw/fully-automatic-dicing-saws/7222-2/ Sun, 21 May 2023 13:03:18 +0000 https://rwolf.co.il/dicing_saw/automatic-dicing-saws/7122-2-3-5/ Up to 8” round product
Up to 8” Silicon Wafers
PCB, QFN and BGA multi panels, highbrightness, LED Packages, SAW Filters

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FEATURES & BENEFITS

  • Efficient wafer handling system
  • Continuous digital magnifications vision system
  • Blade wear prediction algorithm reduces height measurement time and increases UPH
  • Atomized wafer cleaning technology for superior process results

RELATED DOCUMENTS

   Dicing Saws Catalog

   7222

TECHNICAL SPECIFICATIONS

Specifications7222
Workpiece SizeØ 8”
Spindle60K rpm / 1.8 kW or 2.2KW
Blade Size2” – 3”
Y AxisControl
Resolution
Cumulative Accuracy
Indexing Accuracy		Linear encoder
0.1 µm
1.5 µm
1.0 µm
X AxisAir Slide
Z AxisResolution
Repeatability		0.2 µm
1.0 µm
Θ AxisRepeatability
Stroke		4 arc-sec
380°
Cleaning Station

Spinning speed Cleaning
Method		Full rinse and dry cycle
100-2,000 rpm
Atomized cleaning capabilities
UtilitiesElectrical200-240 VAC, 50/60 Hz, single phase
Dimensions(W x D x H) mm
Weight		1700 × 1460 × 965
1,200kg

MATERIALS

  • Silicon
  • Glass on Silicon
  • MEMS
  • GaAs wafers
  • Package Singulation (BGA & QFN)
  • LTCC
  • PCB
  • Hard Materials

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