Low Temperature Co-fired Ceramic (LTCC) substrates are fabricated by laminating individual unfired tapes with printed conductor lines on the surface on top of each other and firing them together in a single step. These products have a low dielectric constant, low dielectric loss and the ability to embed multiple layers of components in a multilayer structure.

Major Considerations:

Cut quality:

  • Ceramic chipping
  • Cracks | Metal burrs
  • Package size


Automatic (7120 series) or Fully Auotomatic (7220 series) dicing systems.
Large area capabilities with complete support for Multi panel.
Automatic height compensation for higher throughput and automatic compensation for index size and other panel dimension distortions.


  • 2″, 3″ and 4″ Resin blades “Q”, “K” and “C” matrixes 
  • Diamond grit size: 15 – 45 µm 
  • Thickness: .006” – .020” (0.15 – 0.5 mm)

Process Parameters:

  • Feed rate: 5 – 25 mm/sec
  • Spindle speed: 10 – 40 krpm depending on blade O.D.
  • Multi panel mounting on UV tape