Silicon Wafers and Discrete Devices
Description:
Silicon is the most common semiconductor material used. It is a gray brittle material with a diamond cubic structure. Silicon wafers are available in sizes up to 12" in diameter, with 6" and 8" being the most common. Typical thicknesses are in the 100 - 650 micron range.
Major Considerations:
Cut quality:
- Top-side and back-side chipping
- Cracking
- Wafer contamination due to ESD issues and poor cleaning
Saw:
7222, fully automatic dicing saw with WX3 wafer handling system for better throughput and Atomized cleaning or the 7900 Duo automatic Twin spindles for double the throughput
Blade:
- 2" hub and Annular Nickel blades
- Diamond grit size: 2-4 to 4-8 microns
- Thickness: .0008” - .0014”
Process Parameters: