Silicon is the most common semiconductor material used. It is a gray brittle material with a diamond cubic structure. Silicon wafers are available in sizes up to 12″ in diameter, with 6″ and 8″ being the most common. Typical thicknesses are in the 200 – 800 micron range.

Major Considerations:

Cut quality:

• Top-side and back-side chipping
• Cracking
• Wafer contamination due to ESD issues and poor cleaning

Saw:

7222, fully automatic dicing saw with WX3 wafer handling system for better throughput and Atomized cleaning or the 7900 Duo automatic Twin spindles for double the throughput  

Blade:

• Hub and Annular Nickel blades
• OD Ø: 2″
• Diamond grit size: 1500 – 5000 mesh
• Thickness: 0.015 – 0.120 mm

Process Parameters:

• Feed rate: 10 – 120 mm/sec
• Spindle speed: 30 – 50 krpm
• Mounting: Blue or UV tape
• Cooling type: DI water with and without additives
• Carbon dioxide bubbler is optional