8030 – Fully Automatic Twin Spindle Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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QFN PACKAGES
ADT offers comprehensive dicing solutions for QFN packages including dicing saws, dicing blades and peripheral equipment.
QFN Range
QFN Dicing Saws Range
7302
Up to 12” round product,
or 9” x 12”square chuck
Up to 12” Silicon Wafers
PCB, QFN and BGA multi panels, LED Packages
7304
Best Solution for Hard Materials
Up to 12” round product, or 9”x12”
square chuck
Glass, Sapphire and other hard materials, Ceramic substrates, Alumina, Hybrids, Thick film devices and more
7222
Up to 8” round product
Up to 8” Silicon Wafers
PCB, QFN and BGA multi panels, highbrightness, LED Packages, SAW Filters
7232
Up to 12” round product, or square
chuck 253x243mm with frame
Silicon wafers, thin-film devices, SAW Filters, Silicon Sensors, PZT and more
7234
Up to 12” round product,
or square chuck
253x243mm with frame
Glass, Sapphire and other hard materials, Ceramic substrates, Alumina, Hybrids, thick film devices and more
7224
Compatible with 4” & 5” annular
blades
Up to 8” round products
Ceramic substrates, Alumina, Hybrids, thick film devices and more
7900 DUO
up to 8″ x 8″ products
7920 DUO
Up to 10” x 10” products
7930 DUO
up to 12” X 10” and 12” round
QFN DICING BLADE TYPES
Thin
Up to 150 µm copper
lead thickness
Standard
Up to 200 µm copper
lead thickness
Challenges
- Tin (Sn) Dicing – Lead melting
- Ni/Pd – Blade breakage and short life
- Blade life
- Burrs and smearing
RESIN BLADES FOR QFN
Matrix Type
E, D, P
OD Ø
2”, 3” 4”
Diamond grit size
45 – 105 µm
Thickness
.008”– .020”
(0.2 mm – 0.5 mm)
Feed rate
20 – 100 mm/sec
Feed rate / Spindle speed
2”: 20 – 40 krpm
3”: 15 – 25 krpm
4”: 8 – 15 krpm
Wear and quality properties
QFN QUALITY CRITERIA
- X;Y;Z Burrs: ≤ 50 Μm
- Smearing: < 25% Of Leads Distance
- Chipping: ≤ 50 Μm
- No Lead Melting
- No Delamination
- Package Dimensions: Nominal ± 50 Μm
QFN Dicing Peripherals Range
SEMI AUTO WAFER MOUNTER 967, 967L
ADT 967 Semi-Automatic Wafer Mounting System is designed to automatically mount wafers on tape
SPINDLE CHILLER 937-A
Designed for closed-loop supply of spindle cooling water
WATER RECYCLING SYSTEM AR-927
Designed for closed-loop, uniform supply of cutting water
