Wafer Cleaner 977
Efficient compact cleaning units to support your process
ADT 977 Wafer Cleaner Systems are designed for cleaning workpieces after dicing.
The systems are offered in three basic configurations :
- WCS-977 – round wafer up to 8"
- WCS-977LA – round wafer up to 12"
- WCS-977D – a standalone coating/de-coating station with:
*Wafer spin coating technology
*Absolute surface protection during dicing
*100% removal of contamination and residue
*Atomized cleaning and N2 drying
977 System Highlights :
- Atomizing cleaning
- Automatic lid closing
- Intuitive control panel
- Process monitoring
- Compact design
- Robust, vibration free
- Environmentally friendly
- Options:
- Build-in mist exhaust unit
- CO2 injection
- Customized chucks
- Cleaning additives
Technical Specifications:
| 977- 200 | 977L - 300 | |
| Max. wafer size | Ø 200 mm | Ø 300 mm |
| Cleaning method | Atomizing cleaning/ High pressure cleaning |
Atomizing cleaning/ High pressure cleaning |
| Number of recipes that can be saved | 8 | 8 |
| Spinner velocity range | 200–3000 rpm | 200–2500 rpm |
| Machine dimensions (WxDxH) | 410 x 625 x 950 mm | 520 x 809 x 950 mm |
| Approx. machine weight | 100 kg | 160 kg |