搭配2吋刀片 - ADT - Advanced Dicing Technologies

搭配2吋刀片 - ADT - Advanced Dicing Technologies https://www.adt-co.com/zh-hant/dicing_saw_cat/2-spindle-fully-automatic-single-spindle-zh-hant/ Advanced Dicing Technologies, Dicing Saws, Blades Tue, 14 Jan 2025 08:41:20 +0000 zh-TW hourly 1 https://wordpress.org/?v=7.0 https://www.adt-co.com/wp-content/uploads/2023/07/cropped-android-chrome-96x96-1-32x32.png 搭配2吋刀片 - ADT - Advanced Dicing Technologies https://www.adt-co.com/zh-hant/dicing_saw_cat/2-spindle-fully-automatic-single-spindle-zh-hant/ 32 32 7302 https://www.adt-co.com/zh-hant/dicing_saw/fully-automatic-dicing-saws/7302-2/ Sun, 21 May 2023 13:29:17 +0000 https://www.adt-co.com/dicing_saw/fully-automatic-dicing-saws/7302-2/ 最大可搭配直徑 12 寸的圓形切割盤，
或 9 寸 x 12 寸的矩形切割盤
最大可處理直徑 12 寸的矽晶片
PCB、QFN 和 BGA 多面板，LED 封裝

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特點與優勢

支援2″-3″刀片直徑
內部氣流管理系統，可將產品污染降至最低
多基板切割
‘X’軸氣軸承，確保平滑運動與極佳切割品質
配備高解析度光學系統的自動化操作
客製製程解決方案

相關文件

Dicing Saws Catalog

73XX Leaflet

其他特點與優勢

UV 解膠系統
斷刀檢測器（適用於2″主軸）
排氣葉輪
高功率2″主軸，功率可達2.2KW
高度測量工具 (HMT)
靜電放電 (ESD) 套件
不間斷電源 (UPS)
條碼讀取器（內建或外接）
SECS GEM 通訊協議

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]]> 7232 https://www.adt-co.com/zh-hant/dicing_saw/fully-automatic-dicing-saws/7232-2/ Sun, 21 May 2023 13:15:10 +0000 https://www.adt-co.com/dicing_saw/fully-automatic-dicing-saws/7232-2/ 最大可搭載直徑 12 寸的圓形切割盤，
或 253x243 mm的矩形盤面
適用於矽晶片、薄膜設備、濾波器、矽感測器、PZT等。

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特點與優勢

高效的晶圓處理系統
連續數位放大視覺系統
刀片磨損預測算法，減少高度測量時間並提升單位產出 (UPH)
霧化晶圓清洗技術，確保卓越的製程結果

相關文件

Dicing Saws Catalog

技術規格

Specifications		7232
Workpiece Size		Ø 12” or 253x243mm
Spindle		60K rpm / 1.8 kW or 2.2KW
Blade Size		2” – 3”
Y Axis	Control Resolution Cumulative Accuracy Indexing Accuracy	Linear encoder 0.1 µm 1.5 µm 1.0 µm
X Axis		Air Slide
Z Axis	Resolution Repeatability	0.2 µm 1.0 µm
Θ Axis	Repeatability Stroke	4 arc-sec 380°
Cleaning Station	Spinning speed Cleaning Method	Full rinse and dry cycle 100-2,000 rpm Atomized cleaning capabilities
Utilities	Electrical	200-240 VAC, 50/60 Hz, single phase
Dimensions	(W x D x H) mm Weight	1100 × 1785 × 1700 1,350kg

材料

矽
硅上玻璃
微機電系統 (MEMS)
砷化鎵 (GaAs) 晶圓
封裝切割 (BGA & QFN)
低溫共燒陶瓷 (LTCC)
印刷電路板 (PCB)
硬質材料

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]]> 7222 https://www.adt-co.com/zh-hant/dicing_saw/fully-automatic-dicing-saws/7222-2/ Sun, 21 May 2023 13:03:18 +0000 https://www.adt-co.com/dicing_saw/fully-automatic-dicing-saws/7222-2/ 最大可搭配直徑 8 寸的圓形產品
最大可放載直徑 8 寸的矽晶片
PCB、QFN 和 BGA 多板、LED 封裝、濾波器

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特點與優勢

高效的晶圓處理系統
連續數位放大視覺系統
刀片磨損預測算法，減少高度測量時間並提升單位產出 (UPH)
霧化晶圓清洗技術，確保卓越的製程結果

相關文件

Dicing Saws Catalog

技術規格

Specifications		7222
Workpiece Size		Ø 8”
Spindle		60K rpm / 1.8 kW or 2.2KW
Blade Size		2” – 3”
Y Axis	Control Resolution Cumulative Accuracy Indexing Accuracy	Linear encoder 0.1 µm 1.5 µm 1.0 µm
X Axis		Air Slide
Z Axis	Resolution Repeatability	0.2 µm 1.0 µm
Θ Axis	Repeatability Stroke	4 arc-sec 380°
Cleaning Station	Spinning speed Cleaning Method	Full rinse and dry cycle 100-2,000 rpm Atomized cleaning capabilities
Utilities	Electrical	200-240 VAC, 50/60 Hz, single phase
Dimensions	(W x D x H) mm Weight	1700 × 1460 × 965 1,200kg

材料

矽
硅上玻璃
微機電系統 (MEMS)
砷化鎵 (GaAs) 晶圓
封裝分離 (BGA & QFN)
低溫共燒陶瓷 (LTCC)
印刷電路板 (PCB)
硬質材料

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