{"id":9565,"date":"2026-05-17T11:29:01","date_gmt":"2026-05-17T11:29:01","guid":{"rendered":"https:\/\/www.adt-co.com\/?post_type=dicing_saw&p=9565"},"modified":"2026-05-19T11:49:33","modified_gmt":"2026-05-19T11:49:33","slug":"8001-2","status":"publish","type":"dicing_saw","link":"https:\/\/www.adt-co.com\/zh-hant\/dicing_saw\/wafer-eraser\/8001-2\/","title":{"rendered":"8001"},"content":{"rendered":"\t\t
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FEATURES & BENEFITS<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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A Shuttle or Multi-Project Wafer (MPW) is a service model where multiple customers share the cost of a single mask set and wafer run to create prototype chips. ADT addresses this need with the 8001 Eraser, designed specifically to support shuttle fab services.<\/p>

Maximize shuttle wafer efficiency with precise, low-impact CO2<\/sub> laser ablation.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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CO2<\/sub> Laser Scribing Module Features<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\n\t\t\t\t\t\t\t\t\t\u2022 10.6 \u03bcm CO2<\/sub> laser head\n\u2022 Typical 50-60 \u03bcm spot size\n\u2022 Adjustable power by PWM method\n\u2022 Precision motion system\n\u2022 Real-time process monitoring\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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Key Advantages of ADT CO2<\/sub> Laser<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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\u2022 Laser energy is absorbed mainly by the patch material, minimizing silicon substrate damage while delivering precise removal
\u2022 Efficient removal of metals and non-Si materials
\u2022 Reduced laser penetration into silicon
\u2022 Lower risk of micro-cracks in silicon<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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Process Enhancements<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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1. Integrated pre-coating cycle
2. Post-process washing and drying for wafer protection, cleanliness, and process stability
3. High-power exhaust particle extraction removes debris immediately during laser ablation<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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RELATED DOCUMENTS<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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\"\"\u00a0 \u00a0Dicing Saws Catalog<\/a><\/span>
\"\"\u00a0 8001 Brochure<\/a><\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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Thermal Laser Power Monitoring<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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The 8001 system includes a built-in thermal laser power sensor to measure the emitted laser power in real-time. This ensures that the software-set power aligns with the actual laser output, enabling
stable production and consistent quality.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

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TECHNICAL SPECIFICATIONS<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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Specifications<\/td>Value<\/td>\n<\/tr>\n
Work piece Size<\/td>Up to \u00d8 300 mm<\/td>\n<\/tr>\n
Laser<\/td>CO2<\/sub> CW water cooled 4 L\/Min<\/td>\n<\/tr>\n
Power<\/td>60W<\/td>\n<\/tr>\n
Indexing Axis (Y)
\nResolution
\nAccuracy Cumulative
\nAccuracy Indexing<\/td>
\n0.2 \u03bcm
\n1.5 \u03bcm
\n1.0 \u03bcm<\/td>\n<\/tr>\n
Feed Axis (X)
\nDrive<\/td>
\nBall bearing lead screw with DC-brushless motor<\/td>\n<\/tr>\n
Cut Depth Axis (Z)
\nResolution<\/td>		USB3 camera, High bright LED illumination (vertical & oblique)
\n0.2 \u03bcm
\n<\/td>\n<\/tr>\n
Rotary Axis (T)
\nAccuracy
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\nStandard<\/td>
\n4 arc-sec (0.001 deg.)
\nCE Certification by default
\nSemi-S2 as an option<\/td>\n<\/tr>\n
Utilities*<\/td><\/td>\n<\/tr>\n
Electrical
\n
\nLaser coolant
\nDimensions
\nWeight<\/td>		200-240 VAC 50\/60 Hz Single Phase
\n2000W
\n4 L\/min
\n1100 X 1740 X 1700 mm
\n1350 Kg<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

CO2 Laser Ablation<\/p>\n

Precision Material Removal with<\/p>\n

Minimal Thermal Impact<\/p>\n","protected":false},"featured_media":2848,"parent":9574,"menu_order":160,"template":"","format":"standard","dicing_saw_cat":[18],"class_list":["post-9565","dicing_saw","type-dicing_saw","status-publish","format-standard","has-post-thumbnail","hentry","dicing_saw_cat-automatic-twin-spindle"],"acf":[],"yoast_head":"\n80WT - Fully automatic dicing saw by ADT - Advanced Dicing Technologies<\/title>\n<meta name=\"description\" content=\"Fully automatic two spindles dicing saw, designed for precise step-cut Wettable QFN dicing.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.adt-co.com\/dicing_saw\/wafer-eraser\/8001-2\/\" \/>\n<meta property=\"og:locale\" content=\"zh_TW\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"80WT - Fully automatic dicing saw by ADT - Advanced Dicing Technologies\" \/>\n<meta property=\"og:description\" content=\"Fully automatic two spindles dicing saw, designed for precise step-cut Wettable QFN dicing.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.adt-co.com\/dicing_saw\/wafer-eraser\/8001-2\/\" \/>\n<meta property=\"og:site_name\" content=\"ADT - 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