SINTERED DICING BLADES
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FEATURES
DICING APPLICATIONS
With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) diamond dicing blades are best suited for retaining package shape and size in applications such as:
BGA, Soft Alumina, TiC, LTCC, Ferrite
Tailored Diamond Dicing Blades
We offer precision-engineered diamond blades customized to meet the exact specifications of your dicing application, ensuring optimal performance and consistent results.
BLADE THICKNESS
From 80 µm to 1500 µm
DIAMOND GRIT SIZE
From 2 µm to 70 µm
SERRATIONS
Serrations available for sintered dicing blades as well as for various edge shapes
| Diamond grit size (µ) | Product | Material | Matrix |
|---|---|---|---|
| 45 up to 55 | BGA , LGA (Tape & Tape-less mounting method) | FR4, Plastic & Molding | C2/R5 |
| 30 up to 50 | QFN ( Half Etched ) | Cu leadframe + molding | Q7/C1 |
| 35 up to 45 | Passive & Active Devices. Communication Modules | LTCC | P1/P9 |
| 35 up to 45 | SAW Devices, RF Package | HTCC | P1 |
| 13 up to 25 | Camera Module | Glass/ IR Glass | P1/P5 |
| 25 up to 45 | Ceramic Packages | Alumina | P5/P9 |
METAL SINTERED DICING BLADES PART NUMBER DESCRIPTION
NOVUS – METAL SINTERED DICING BLADES PART NUMBER DESCRIPTION
