A Shuttle or Multi-Project Wafer (MPW) is a service model where multiple customers share the cost of a single mask set and wafer run to create prototype chips. ADT addresses this need with the 8001 Eraser, designed specifically to support shuttle fab services.
Maximize shuttle wafer efficiency with precise, low-impact CO2 laser ablation.
• Laser energy is absorbed mainly by the patch material, minimizing silicon substrate damage while delivering precise removal
• Efficient removal of metals and non-Si materials
• Reduced laser penetration into silicon
• Lower risk of micro-cracks in silicon
1. Integrated pre-coating cycle
2. Post-process washing and drying for wafer protection, cleanliness, and process stability
3. High-power exhaust particle extraction removes debris immediately during laser ablation
RELATED DOCUMENTS
The 8001 system includes a built-in thermal laser power sensor to measure the emitted laser power in real-time. This ensures that the software-set power aligns with the actual laser output, enabling
stable production and consistent quality.
| Specifications | Value |
| Work piece Size | Up to Ø 300 mm |
| Laser | CO2 CW water cooled 4 L/Min |
| Power | 60W |
| Indexing Axis (Y) Resolution Accuracy Cumulative Accuracy Indexing | 0.2 μm 1.5 μm 1.0 μm |
| Feed Axis (X) Drive | Ball bearing lead screw with DC-brushless motor |
| Cut Depth Axis (Z) Resolution | USB3 camera, High bright LED illumination (vertical & oblique) 0.2 μm |
| Rotary Axis (T) Accuracy Standard | 4 arc-sec (0.001 deg.) CE Certification by default Semi-S2 as an option |
| Utilities* | |
| Electrical Laser coolant Dimensions Weight | 200-240 VAC 50/60 Hz Single Phase 2000W 4 L/min 1100 X 1740 X 1700 mm 1350 Kg |
Copyright © ADT – Advanced Dicing Technologies, 2025
ADT – a leading developer & global supplier of high-performance Dicing Solutions, including Dicing Saws, Dicing Blades, Dicing Peripherals, and a complete range of Accessories — engineered for precision, built for excellence.
Design Maxmark
