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8001 - CO2 Laser Ablation Wafer Eraser


FEATURES & BENEFITS

A Shuttle or Multi-Project Wafer (MPW) is a service model where multiple customers share the cost of a single mask set and wafer run to create prototype chips. ADT addresses this need with the 8001 Eraser, designed specifically to support shuttle fab services.

Maximize shuttle wafer efficiency with precise, low-impact CO2 laser ablation.

CO2 Laser Scribing Module Features

• 10.6 μm CO2 laser head • Typical 50-60 μm spot size • Adjustable power by PWM method • Precision motion system • Real-time process monitoring

Key Advantages of ADT CO2 Laser

• Laser energy is absorbed mainly by the patch material, minimizing silicon substrate damage while delivering precise removal
• Efficient removal of metals and non-Si materials
• Reduced laser penetration into silicon
• Lower risk of micro-cracks in silicon

Process Enhancements

1. Integrated pre-coating cycle
2. Post-process washing and drying for wafer protection, cleanliness, and process stability
3. High-power exhaust particle extraction removes debris immediately during laser ablation

RELATED DOCUMENTS

Thermal Laser Power Monitoring

The 8001 system includes a built-in thermal laser power sensor to measure the emitted laser power in real-time. This ensures that the software-set power aligns with the actual laser output, enabling
stable production and consistent quality.

TECHNICAL SPECIFICATIONS

SpecificationsValue
Work piece SizeUp to Ø 300 mm
LaserCO2 CW water cooled 4 L/Min
Power60W
Indexing Axis (Y)
Resolution
Accuracy Cumulative
Accuracy Indexing

0.2 μm
1.5 μm
1.0 μm
Feed Axis (X)
Drive

Ball bearing lead screw with DC-brushless motor
Cut Depth Axis (Z)
Resolution
USB3 camera, High bright LED illumination (vertical & oblique)
0.2 μm
Rotary Axis (T)
Accuracy

Standard

4 arc-sec (0.001 deg.)
CE Certification by default
Semi-S2 as an option
Utilities*
Electrical

Laser coolant
Dimensions
Weight
200-240 VAC 50/60 Hz Single Phase
2000W
4 L/min
1100 X 1740 X 1700 mm
1350 Kg