ADT specializes in the development and manufacturing of dicing saws, blades and peripherals for a wide variety of applications: silicon- based ICs, Package Singulation and hard material Microelectronic Components (MEC).

ADT is a one stop shop with end-to-end research, development and production held in the company’s advanced ISO 9001:2015 certified facilities.
Our R&D department is known for combining deep technological know-how, vast experience and out-of-the-box solutions.

ADT’s dicing saws’ line offer a variety of capabilities, configurations and levels of automation as well as unique solutions for special materials and applications. The dicing saws range includes automatic saws, fully automatic saws with single and double spindle, as well as special machines for tailored applications.

ADT’s top notch dicing diamond blades range includes resin blades, sintered blades, nickel blades and hub blades. Answering the ever-growing customer requirements, ADT’s blades are the perfect dicing solution for various materials and substrates, such as: QFN package, BGA package, ceramics, glass, quartz, sapphire and tailor-made solutions for challenging materials and applications.

ADT offers additional dicing peripheral equipment and accessories, such as water cleaning system, water recycling system, spindle water chiller, semi-auto wafer mounting and more.