Resin BOND DICING Blades
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FEATURES
RESIN BINDER
Resin binder enables blade wear management.
DICING APPLICATIONS
Resin-Bond Dicing Blades are an excellent choice for hard and brittle materials such as: QFN, Thick Ceramic Substrates, LTCC and Glass,
Wettable QFN
Wettable QFN
DICING BLADE THICKNESS
From 75 µm to 2500 µm
DIAMOND GRIT SIZE
From 3 µm to 250 µm
Tailored Diamond Dicing Blades
We offer precision-engineered diamond blades customized to meet the exact specifications of your dicing application, ensuring optimal performance and consistent results.
| Diamond grit size (µ) | Product | Material | Matrix |
|---|---|---|---|
| 35 up to 53 | Ceramic Packages, Sensors | Alumina / AlN | C02/C07 |
| 53 up to 88 | QFN (Half Etched Cu) + Wettable QFN (full cut) | Cu leadframe + molding | D02/D07 |
| 53 up to 88 | QFN (Full Cu) | Cu leadframe + molding | E01 |
| 35 up to 53 | DFN (0.3-0.5mm) | Cu leadframe + molding | E31/D02 |
| 53 up to 88 | Wettable QFN First cut | Cu leadframe + molding | P07 |
| 30 up to 45 | SAW Devices, RF Package | HTCC | QKP/C02 |
| 30 up to 53 | CCD / Filter / Lens | Glass / Quartz | QKP/E33 |
| 45 up to 63 | Optical & Electro Optical Components | Sapphire | QKP |
| 30 up to 53 | Passive & Active Devices. Communication Modules | LTCC | QKP |
RESIN-BOND DICING BLADES PART NUMBER DESCRIPTION
