Resin-bond Dicing Blades
- Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
- Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
- Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
“T”, “D” & “P” Resin blades are our latest development for superior QFN cutting results:
- Better blade life (More than 4,000m)
- Improved cut quality
- Better throughput
RESIN-BOND BLADES PART NUMBER DESCRIPTION
