8030 – Fully Automatic Twin Spindle Dicing Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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7232 - Fully automatic dicing saw
FEATURES & BENEFITS
- Efficient wafer handling system
- Continuous digital magnifications vision system
- Blade wear prediction algorithm reduces height measurement time and increases UPH
- Atomized wafer cleaning technology for superior process results
RELATED DOCUMENTS
TECHNICAL SPECIFICATIONS
| Specifications | 7232 | |
| Workpiece Size | Ø 12” or 253x243mm | |
| Spindle | 60K rpm / 1.8 kW or 2.2KW | |
| Blade Size | 2” – 3” | |
| Y Axis | Control Resolution Cumulative Accuracy Indexing Accuracy | Linear encoder 0.1 µm 1.5 µm 1.0 µm |
| X Axis | Air Slide | |
| Z Axis | Resolution Repeatability | 0.2 µm 1.0 µm |
| Θ Axis | Repeatability Stroke | 4 arc-sec 380° |
| Cleaning Station | Spinning speed Cleaning Method | Full rinse and dry cycle 100-2,000 rpm Atomized cleaning capabilities |
| Utilities | Electrical | 200-240 VAC, 50/60 Hz, single phase |
| Dimensions | (W x D x H) mm Weight | 1100 × 1785 × 1700 1,350kg |
MATERIALS
- Silicon
- Glass on Silicon
- MEMS
- GaAs wafers
- Package Singulation
- (BGA & QFN)
- LTCC
- PCB
- Hard Materials
