80Ai - Fully Automatic 12" Twin Dicing System

FEATURES

• Fully automatic twin process
• Support for 3″ OD blades
• Capable of handling products up to 10 mm thick
• Microscope with 70 mm Focal Length
• Oblique illumination for enhanced 70 mm focus
• Advanced software features
• Supports heavy product handling

LEADING APPLICATIONS

• DC to DC Converter
• Silicon wafers for Memory and Logic products
• MEMS (micro-electromechanical system)
• CMOS Image Sensors (CIS)
• Packaging (FOPLP, FOWLP, QFN, BGA)

TECHNICAL SPECIFICATIONS

Specifications	Value
Machine Model	80Ai
Workpiece Size	Ø8, Ø 12" or 12" by 12" Square Up to 10 mm thick
Spindles	Two 1.9KW shaft-lock facing spindles (option of 2.2KW)
Blade Size	2” – 3”
Y1/Y2 Axis Drive Control Resolution Cumulative Accuracy Indexing Accuracy Cutting range	Ball bearing lead screw Linear encoder for each Y-axis 0.1 μm 1.5 μm 1.0 μm 310 mm
X Axis Axis Drive Feed rate Cutting range	Air Slide Ball bearing lead screw Up to 600 mm/sec (option of 1000 mm/sec) 310 mm
Z1 / Z2 Axis Resolution Repeatability Max. stroke	USB3 camera, High bright LED illumination (vertical & oblique) 0.2 μm 1.0 μm 30 mm (for 2.188" OD blade)
Θ Axis Drive Repeatability Stroke	Slot to slot integrity Closed-loop, Direct-drive 4 arc-sec 380°
Vision System	USB3 camera, High bright LED illumination (vertical & oblique)
Microscope	70 mm focal lengh
Cleaning Station Spinning speed Cleaning Method	Full rinse and dry cycle 100–3,000 rpm Atomized cleaning capabilities
Wafer Handling System	Slot-to-slot integrity Inspection drawer
User Interface	Two touch screens: a 19" main screen monitor and a 17" monitor for maintenance NUI (New Graphic User Interface) with multilanguage support
Standard Features	Automatic: Alignment, Kerf check, Y offset, and Cut verify
Utilities Electrical Air Spindle Coolant Cutting water	200-240 VAC, 50/60 Hz, single phase 500 L/min @ 5.5 bar 1.1 L/min (per spindle) Up to 3 L/min (per spindle)
Dimensions WxDxH Weight	1125mm × 1667mm × 1820mm 1500 kg
Environmental	Room Temperature: 20°C to 25°C ± 1°C (77°F ± 1.8°F) Humidity: Less than 70% relative humidity (non-condensing) Cutting water / Spindle Water, Temperature ± 1°C (± 1.8°F) Floor must be vibration free
Options	UV station CO2 bubbler ESD air blower kit Dicing Floor Management (SECS GEM)