Taiwan
USA

DICING SOLUTIONS FOR BGA PACKAGES

ADT offers comprehensive dicing solutions for BGA including dicing saws, dicing blades and peripheral equipment.

DICING SOLUTIONS FOR BGA Range

Dicing Saws
For DICING SOLUTIONS FOR BGA

Dicing Blades
For DICING SOLUTIONS FOR BGA

Dicing Peripherals
For DICING SOLUTIONS FOR BGA

DICING SOLUTIONS FOR BGA Dicing Saws Range

7222

Up to 8” round product
Up to 8” Silicon Wafers
PCB, QFN and BGA multi panels, highbrightness, LED Packages, SAW Filters

7224

Compatible with 4” & 5” annular
blades
Up to 8” round products
Ceramic substrates, Alumina, Hybrids, thick film devices and more

BGA dicing blade types

Challenges

Blade life – Radial wear, thickness wear & maintaining package size
Chipping

Blades for BGA

Market Requirements

Chipping: < 50 mm
Package size: Nominal ± 50 mm

NOVUS R series – BGA package size comparison

Application results on PCB

Blades parameters:
58mm x 0.27mm x 40mm, Std. edge shape

Test parameters:
Substrate: PCB 1.6mm thickness
Cut Depth: 1.3mm
Cut length: 900m
Feed Rate: 100 mm/sec
Spindle Speed: 35 krpm

DICING SOLUTIONS FOR BGA Dicing Peripherals Range

MANUAL WAFER MOUNTER 966, 966L

Designed for manual mounting of workpieces on tapes