8030 – Fully Automatic Twin Spindle Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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BGA PACKAGES
ADT offers comprehensive dicing solutions for BGA including dicing saws, dicing blades and peripheral equipment.
BGA Range
BGA Dicing Saws Range
7222
Up to 8” round product
Up to 8” Silicon Wafers
PCB, QFN and BGA multi panels, highbrightness, LED Packages, SAW Filters
7232
Up to 12” round product, or square
chuck 253x243mm with frame
Silicon wafers, thin-film devices, SAW Filters, Silicon Sensors, PZT and more
7234
Up to 12” round product,
or square chuck
253x243mm with frame
Glass, Sapphire and other hard materials, Ceramic substrates, Alumina, Hybrids, thick film devices and more
7224
Compatible with 4” & 5” annular
blades
Up to 8” round products
Ceramic substrates, Alumina, Hybrids, thick film devices and more
BGA dicing blade types
Challenges
- Blade life – Radial wear, thickness wear & maintaining package size
- Chipping
Blades for BGA
Matrix Type
C, R
OD Ø
2”, 3”
Diamond grit size
35 –70 µm
Thickness
.004”– .020”
(0.1mm – 0.5mm)
Feed rate
20– 250 mm/sec
Spindle speed
2”: 30–45 krpm
3”: 20–30 krpm
4”: 8–15 krpm
Market Requirements
Chipping: < 50 mm
Package size: Nominal ± 50 mm
NOVUS R series – BGA package size comparison
Application results on PCB
Blades parameters:
58mm x 0.27mm x 40mm, Std. edge shape
Test parameters:
Substrate: PCB 1.6mm thickness
Cut Depth: 1.3mm
Cut length: 900m
Feed Rate: 100 mm/sec
Spindle Speed: 35 krpm
BGA Dicing Peripherals Range
MANUAL WAFER MOUNTER 966, 966L
Designed for manual mounting of workpieces on tapes
