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Wettable QFN PACKAGES

Following the demand from the automotive industry for chip soldering that will withstand zero faults over time, ADT developed solutions for the wettable technology.
Designed to ensure the highest safety standards for the automotive industry:
– Wettable technology for optimal soldering results
– Visible soldering allowing 100% Automated Optical Inspection (AOI)

Wettable QFN Range

Dicing Saws
For Wettable QFN
Dicing Blades
For Wettable QFN
Dicing Peripherals
For Wettable QFN

Wettable QFN Dicing Saws Range

80WT

Twin spindles 2”- 3”
Tapeless for wettable flanks QFN
Silicon wafers, thin glass, QFN and BGA multi pannels

WETTABLE QFN Challenge

Constant groove depth on uneven surface thickness,
while maintaining blade profile shape with high cut quality.

The depth of the Groove (1st cut) should remain constant, so the path of the dicing blade must always follow the top surface profile of the substrate.

Wettable Technology Step-Cut Dicing Process

1st cut

Shallow Cut

2nd cut

Cut Trough / Singulation

* After plating the cutting area

ADT's Dicing Blades for Wettable H/E QFN

1st cut

P07 matrix

Resin Blade

2nd cut

D02 matrix

Resin Blade

P07 matrix

Absorb and dissipate the heat during dicing to improve the cut quality by maintaining the blade edge shape and preventing the “W” phenomenon

Matrix Type

P07

OD Ø

2”

Diamond grit size

45 – 88 µm

Thickness

.01”– .02"
(0.25 mm – 0.5 mm)

Feed rate

20 – 40 mm/sec

Spindle speed

20 – 25 krpm

D02 matrix

Our leading matrix for qfn dicing, provides good cut quality with high blade life.

Matrix Type

D02

OD Ø

2”, 3”

Diamond grit size

42– 88 µm

Thickness

.008” – .020”
(0.2 mm – 0.5 mm)

Feed rate

50 – 80 mm/sec

Spindle speed

22 – 30 krpm

Wettable QFN Dicing Peripherals Range

WATER RECYCLING SYSTEM AR-927

Designed for closed-loop, uniform supply of cutting water

SPINDLE CHILLER 937-A

Designed for closed-loop supply of spindle cooling water