COMPLETE SOLUTIONS FOR MAJOR DICING APPLICATIONS
QFN
BGA
Ceramics
Glass, Sapphire
Wettable QFN
ADT - YOUR DICING PARTNER
ADT develops and manufactures unique diamond dicing saws and blades, answering the needs of various industries, such as the semiconductor and microelectronic industry. With over 20 years of experience, our team will do everything to ensure you get the right solution for your challenge.
Tailored Diamond Dicing Blades
We offer precision-engineered diamond blades customized to meet the exact specifications of your dicing application, ensuring optimal performance and consistent results.
HIGHLIGHTS
8030 – Fully Automatic Twin Spindle Dicing Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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7304 Dicing Saw – The only Fully Automatic 4” spindle Worldwide
7304 is the perfect choice for hard materials dicing, such as glass, sapphire and more.
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AR-927 – The ultimate solution for recycling dicing water
AR - 927 provides the ultimate solution for dicing water. It provides water recirculation, high-end filtration, process...
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Resin Blades for QFN Packages
ADT provides top of the line blades solutions for QFN packages dicing: thin, standard and wettable applications.
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Novus – cutting edge dicing blades for BGA
Novus blades provide high stiffness and enhanced durability for package size, breakages and bending in BGA, LGA...
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80WT
Fully automatic two spindles dicing saw, designed for precise step-cut Wettable QFN dicing.
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