產品亮點 |
80Ai – Introducing the 80Ai Dicing System
AI technology is advancing at an extraordinary pace, driving unprecedented demands for high-performance AI components.
Key features of the 80Ai solution
- Fully automatic twin process
- Support for 3″ OD blades
- Capable of handling products up to 10 mm thick
- Microscope with 70 mm Focal Length
- Oblique illumination for enhanced 70 mm focus
- Advanced software features
- Supports heavy product handling
Leading Applications
- DC to DC Converter
- Silicon wafers for Memory and Logic products
- MEMS (micro-electromechanical system)
- CMOS Image Sensors (CIS)
- Packaging (FOPLP, FOWLP, QFN, BGA)
