
燒結金屬結合劑刀片的磨損速度較樹脂慢但比鎳快,最適合在以下應用中保持封裝形狀和尺寸:
BGA
軟質氧化鋁
碳化鈦 (TiC)
低溫共燒陶瓷 (LTCC)
鐵氧體
從 80 µm 到 1500 µm
從 2 µm 到 70 µm
燒結刀片以及各種邊緣形狀均可提供鋸齒形狀
Diamond grit size (µ) | Product | Material | Matrix |
---|---|---|---|
45 up to 55 | BGA , LGA (Tape & Tape-less mounting method) | FR4, Plastic & Molding | C2/R5 |
30 up to 50 | QFN ( Half Etched ) | Cu leadframe + molding | Q7/C1 |
35 up to 45 | Passive & Active Devices. Communication Modules | LTCC | P1/P9 |
35 up to 45 | SAW Devices, RF Package | HTCC | P1 |
13 up to 25 | Camera Module | Glass/ IR Glass | P1/P5 |
25 up to 45 | Ceramic Packages | Alumina | P5/P9 |