With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as:
BGA
Soft Alumina
TiC
LTCC
Ferrite
From 80 µm to 1500 µm
From 2 µm to 70 µm
Serrations available for sintered blades as well as for various edge shapes
以下是為了能夠滿足段落所需的長度而定義的無意義內文,請自行參酌編排。
Diamond grit size (µ) | Product | Material | Matrix |
---|---|---|---|
45 up to 55 | BGA , LGA (Tape & Tape-less mounting method) | FR4, Plastic & Molding | C2/R5 |
30 up to 50 | QFN ( Half Etched ) | Cu leadframe + molding | Q7/C1 |
35 up to 45 | Passive & Active Devices. Communication Modules | LTCC | P1/P9 |
35 up to 45 | SAW Devices, RF Package | HTCC | P1 |
13 up to 25 | Camera Module | Glass/ IR Glass | P1/P5 |
25 up to 45 | Ceramic Packages | Alumina | P5/P9 |