BGA PACKAGES
ADT offers comprehensive dicing solutions for BGA including dicing saws, dicing blades and peripheral equipment.
BGA Range
BGA Dicing Saws Range
7232
最大可搭載直徑 12 寸的圓形切割盤，
或 253×243 mm的矩形盤面
適用於矽晶片、薄膜設備、濾波器、矽感測器、PZT等。
7222
最大可搭配直徑 8 寸的圓形產品
最大可放載直徑 8 寸的矽晶片
PCB、QFN 和 BGA 多板、LED 封裝、 濾波器
7234
-最大可搭配直徑 12 寸的圓形產品，
或 253×243 mm的方形切割盤
玻璃、藍寶石和其他硬材料、陶瓷基板、氧化鋁、混合材料、厚膜器件等。
7224
Compatible with 4” & 5” annular
blades
Up to 8” round products
Ceramic substrates, Alumina, Hybrids, thick film devices and more
BGA dicing blade types
Challenges
- Blade life – Radial wear, thickness wear & maintaining package size
- Chipping
Blades for BGA
Matrix Type
C, R
OD Ø
2”, 3”
Diamond grit size
35 –70 µm
Thickness
.004”– .020”
(0.1mm – 0.5mm)
Feed rate
20– 250 mm/sec
Spindle speed
2”: 30–45 krpm
3”: 20–30 krpm
4”: 8–15 krpm
Market Requirements
Chipping: < 50 mm
Package size: Nominal ± 50 mm
NOVUS R series – BGA package size comparison
Application results on PCB
Blades parameters:
58mm x 0.27mm x 40mm, Std. edge shape
Test parameters:
Substrate: PCB 1.6mm thickness
Cut Depth: 1.3mm
Cut length: 900m
Feed Rate: 100 mm/sec
Spindle Speed: 35 krpm
