Wettable QFN PACKAGES
Following the demand from the automotive industry for chip soldering that will withstand zero faults over time, ADT developed solutions for the wettable technology.
Designed to ensure the highest safety standards for the automotive industry:
– Wettable technology for optimal soldering results
– Visible soldering allowing 100% Automated Optical Inspection (AOI)
Wettable QFN Range
Wettable QFN Dicing Saws Range
80WT
雙主軸搭配2 寸至 3 寸
應用於wettable flanks QFN tapeless製程
適用於矽晶圓、薄玻璃、QFN 和 BGA 多板排列
WETTABLE QFN Challenge
Constant groove depth on uneven surface thickness,
while maintaining blade profile shape with high cut quality.
The depth of the Groove (1st cut) should remain constant, so the path of the dicing blade must always follow the top surface profile of the substrate.
Wettable Technology Step-Cut Dicing Process
1st cut
Shallow Cut
2nd cut
Cut Trough / Singulation
* After plating the cutting area
ADT's Dicing Blades for Wettable H/E QFN
1st cut
P07 matrix
Resin Blade
2nd cut
D02 matrix
Resin Blade
P07 matrix
Absorb and dissipate the heat during dicing to improve the cut quality by maintaining the blade edge shape and preventing the “W” phenomenon
Matrix Type
P07
OD Ø
2”
Diamond grit size
45 – 88 µm
Thickness
.01”– .02"
(0.25 mm – 0.5 mm)
Feed rate
20 – 40 mm/sec
Spindle speed
20 – 25 krpm
D02 matrix
Our leading matrix for qfn dicing, provides good cut quality with high blade life.
Matrix Type
D02
OD Ø
2”, 3”
Diamond grit size
42– 88 µm
Thickness
.008” – .020”
(0.2 mm – 0.5 mm)
Feed rate
50 – 80 mm/sec
Spindle speed
22 – 30 krpm
Wettable QFN Dicing Peripherals Range
SPINDLE CHILLER 937-A
主軸冷卻機(水冷)
